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Optimization of Thermoelectric Coolers for Hotspot Cooling in Three Dimensional Stacked Chips
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) chip stacking architecture is expected to reduce form factor, improve performance, and decrease power consumption in future microelectronics. High power density and nonuniform power distribution in ...
Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study investigates heat dissipation at carbon nanotube (CNT) junctions supported on silicon dioxide substrate using molecular dynamics simulations. The temperature rise in a CNT (∼top CNT) not making direct contact ...
Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A major challenge in maintaining quality and reliability in today's microelectronics chips comes from the ever increasing levels of integration in the device fabrication, as well as from the high current densities. Transient ...
Love Wave Propagation in Vertical Heterogeneous Fiber-Reinforced Stratum Imperfectly Bonded to a Micropolar Elastic Substrate
Publisher: American Society of Civil Engineers
Abstract: The microstructure that lies within a continuum sometimes plays a very important role, and hence, mechanics associated with the microstructure cannot be disregarded during the study of elastodynamic problems in such a ...
Optimization of Al2O3 and TiO2 Blends to be Used as Erosion Resistant Coating for Mild Steel
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the hydro power plants, mild steel pipes are used to transport river water from Dam to the turbine house. This water usually contains sand particles that are also transported through these pipelines that are observed ...
Multiscale Transient Thermal Analysis of Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for ...
On Chip Power Generation Using Ultrathin Thermoelectric Generators
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermoelectric generators (TEGs) can significantly improve the net power consumption and battery life of the low power mobile devices or high performance devices by generating power from their waste heat. Recent advancements ...
3D Compact Model of Packaged Thermoelectric Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Hotspots on a microelectronic package can severely hurt the performance and longterm reliability of the chip. Thermoelectric coolers (TECs) can provide sitespecific and ondemand cooling of hot spots in microprocessors. We ...
Solving Nongray Boltzmann Transport Equation in Gallium Nitride
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Several studies have validated that diffusive Fourier model is inadequate to model thermal transport at submicron length scales. Hence, Boltzmann transport equation (BTE) is being utilized to improve thermal predictions ...
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal ...